Effect of Addition Elements on Creep Properties of the Sn-Ag-Cu Lead Free Solder
نویسندگان
چکیده
منابع مشابه
Creep Behavior of a Sn-Ag-Bi Pb-Free Solder
Compression creep tests were performed on the ternary 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) Pb-free alloy. The test temperatures were: −25 °C, 25 °C, 75 °C, 125 °C, and 160 °C (± 0.5 °C). Four loads were used at the two lowest temperatures and five at the higher temperatures. The specimens were tested in the as-fabricated condition or after having been subjected to one of two air a...
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The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents' mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) CueSn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic...
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The effect of Au addition on the microstructural and the tensile properties of Sn–0.7 mass%Cu alloy was examined. Tensile strength and 0.2% proof stress remarkably increase up to 0.3 mass%Au primarily due to solid solution hardening. Beyond 0.3 mass%Au, due to precipitation of large intermetallic compounds, elongation decreases while tensile strength and 0.2% proof stress increase slightly. Wit...
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The effect of Al on the corrosion resistance behaviour of Pb-free Sn–1.0Ag–0.5Cu–xAl solder (x 1⁄4 0.2 wt%, 0.5 wt% and 1.0 wt%) in 5% NaCl solution was investigated by using potentiodynamic polarization and salt spray exposure. Passivation behaviour was evident in all the solder formulations containing Al, compared to the base SAC solder. FESEM and XRD results revealed that more dense passive ...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2006
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.9.171